China Postdoctoral Science Foundation GrantChina Postdoctoral Science Foundation [2016M590873]
机构署名：
本校为通讯机构
院系归属：
机械工程学院
摘要：
Packaging process had been studied on capacitance accelerometer. The silicon-glass bonding process had been adopted on sensor chip and glass, and sensor chip and glass was adhered on ceramic substrate, the three-layer structure was curved due to the thermal mismatch, the slice error of glass lead to asymmetrical curve of sensor chip. Thus, the sensitive mass of accelerometer deviated along the sensitive direction, which was caused in zero offset drift. It was meaningful to confirm the influence of slice error of glass, the simulation results showed that th...
