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Influence of parameters of bidirectional pulse power supply on copper plating on printed circuit board

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成果类型:
会议论文
作者:
Wang, Shoutao;Chen, Wenguang;Liu, Zhijian;Wei, Caiyi;Peng, Yuanyuan
通讯作者:
Chen, WG
作者机构:
[Wang, Shoutao; Peng, Yuanyuan; Wei, Caiyi; Chen, Wenguang; Liu, Zhijian] Univ South China, Sch Elect Engn, Hengyang, Peoples R China.
通讯机构:
[Chen, WG ] U
Univ South China, Sch Elect Engn, Hengyang, Peoples R China.
语种:
英文
关键词:
Printed circuit board;Bidirectional pulse power supply;Forward and reverse pulse duty cycle ratio;Current density;Frequency
期刊:
2022 9TH INTERNATIONAL FORUM ON ELECTRICAL ENGINEERING AND AUTOMATION, IFEEA
年:
2022
页码:
76-80
会议名称:
9th International Forum on Electrical Engineering and Automation (IFEEA)
会议时间:
NOV 04-06, 2022
会议地点:
ELECTR NETWORK
会议主办单位:
[Wang, Shoutao;Chen, Wenguang;Liu, Zhijian;Wei, Caiyi;Peng, Yuanyuan] Univ South China, Sch Elect Engn, Hengyang, Peoples R China.
主编:
IEEE
出版地:
345 E 47TH ST, NEW YORK, NY 10017 USA
出版者:
IEEE
ISBN:
978-1-6654-6421-5
基金类别:
Funded for the National Key Research and Development Program [2018YFE0303103]; Hunan graduate scientific research innovation project
机构署名:
本校为第一且通讯机构
院系归属:
电气工程学院
摘要:
Printed circuit boards are the most important basic electronic components in the electronics industry, and copper plating technology is widely used in the field of printed circuit board manufacturing. Pulse plating is more efficient and environmentally friendly than DC plating, and the plating layer of pulse plating is more uniform and detailed. The effect of bidirectional pulse power supply parameters on the copper plating effect of printed circuit board surface was investigated by using a self-developed bidirectional pulse power supply. The experimental results show that the frequency, forwa...

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