期刊论文

Chen, W.(chenwg@usc.edu.cn)

中文

真空科学与技术学报

1672-7126

2009

29

3

328-331

10.3969/j.issn.1672-7126.2009.03.22

科技部中小企业创新基金（No.07C26214301755）；

本校为第一且通讯机构

工业上用磁控溅射技术为太阳能集热管制备Al-N/Al选择性吸收涂层,这种吸收涂层最外层为AlN介质减反层.在开环N_2流量控制模式下,存在溅射制备AlN介质减反层沉积速率低的缺点.本文依据气相化学反应动力学理论,薄膜的沉积率正比于反应气体的浓度,提出了一种提高制备AlN陶瓷减反层沉积速率的方法.该方法将直流溅射靶电压反馈至模糊控制器,控制N_2流量大小,让磁控溅射镀膜机稳定工作在拐点电压附近,实现反应溅射恒电压控制.并且采用单片机技术制作了样机,在SCS-700A型太阳能集热管镀膜机中使用,实验结果表明,镀膜沉积速率提高了4倍以上,整个系统工作稳定.

The conventional magnetron sputtering technology was modified to enhance the reactive deposition rate of the AlN films on industrial scale with N2 flow controlled in the open-loop mode, based on gas phase chemical reaction dynamics. Since the deposition rate is proportional to the concentration of the reactive gas, the N2 flow is controlled by feeding back the voltage signal of the DC sputtering power to the fuzzy controller, automated with the dedicated microprocessor, so as to stabilize the reactive sputtering voltage. The lab-built prototype N2 flow controller was installed in the SCS-700A ...