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Development of Bidirectional Pulsed Power Supply and Its Effect on Copper Plating Effect of Printed Circuit Board Via-Filling

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成果类型:
期刊论文
作者:
Chen, Wenguang;Wang, Shoutao;Liu, Zhijian;Wei, Caiyi;Peng, Yuanyuan
通讯作者:
Wenguang Chen
作者机构:
[Wang, Shoutao; Peng, Yuanyuan; Wei, Caiyi; Liu, Zhijian; Chen, Wenguang] Univ South China, Sch Elect Engn, Hengyang 421001, Peoples R China.
通讯机构:
[Wenguang Chen] A
Author to whom correspondence should be addressed.
语种:
英文
关键词:
bidirectional asymmetric pulse power supply;printed circuit board;via-filling copper plating;LLC resonant converter
期刊:
Electronics
ISSN:
2079-9292
年:
2023
卷:
12
期:
3
页码:
631-
基金类别:
Conceptualization, S.W. and W.C.; methodology, S.W.; software, Y.P. and S.W; validation, S.W., C.W. and Z.L.; formal analysis, W.C.; investigation, S.W.; resources, W.C.; data curation, S.W.; writing—original draft preparation, S.W.; writing—review and editing, Z.L. and C.W; visualization, S.W.; supervision, W.C.; project administration, S.W.; funding acquisition, S.W. and W.C. All authors have read and agreed to the published version of the manuscript. This research was funded by the Hunan Graduate Scientific Research Innovation Project (223YSL009).
机构署名:
本校为第一机构
院系归属:
电气工程学院
摘要:
A bidirectional pulse power supply with continuously adjustable forward parameters 8 V/20 A and reverse parameters 20 V/50 A was designed using DSP (Digital Signal Processor), and the bidirectional pulse power supply was used to test copper plating on printed circuit boards with filled via holes. The effects of frequencies, pulse width ratios of forward and reverse currents, and current densities on the copper plating effect were investigated by the single variable method and were compared with DC copper plating. The experimental results showed that compared with DC power supply, the bidirecti...

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