LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for non-conductive adhesives for an imidazole curing system. The optimized composition of the adhesive is 25%wt for the curing agent and 30%wt for the silica. The prepared non-conductive adhesive has a 7-day pot life and 9-month storage stability. The shear strength reached 87 g and 72 g at 25 degrees C and 160 degrees C, respectively. The reliability ...
